Ceramic Boron Nitride Isolation Components For PVD CVD Magnetron Sputtering Systems

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  • 1 - 9 Pieces
    $20.00
  • >=10 Pieces
    $15.00
Lead Time:
Quantity(Pieces) 1 - 10 >10
Est. Time(days) 5 Negotiable
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Overview
Quick Details
Place of Origin:
Fujian, China
Type:
Ceramic Parts
Application:
Industrial Ceramic
Model Number:
Boron Nitride Nozzle
Brand Name:
INNOVACERA
Color:
White
Density:
2.1-2.19g/cm3
Max Working Temperature:
2200C
Water Absorption:
0 %
Purity:
99%
Flexural Strength:
243Mpa
Compositions:
99%BN
Compressive strength:
287
Hardness:
2Moh's
Thermal Conductivity:
35-60
Supply Ability
Supply Ability:
100000 Piece/Pieces per Month
Packaging & Delivery
Packaging Details
Export Carton, Wooden Box, Plastic/Wooden Pallet
Port
Xiamen
Picture Example:
package-img
Lead Time :
Quantity(Pieces) 1 - 10 >10
Est. Time(days) 5 To be negotiated

Ceramic Boron Nitride Isolation Components For PVD CVD Magnetron Sputtering Systems

 

Product Description

Boron Nitride is a high temperature, lubricious ceramic. It offers excellent electrical resistance, chemical stability and wet ability.

Boron nitride shapes and ceramic components are critical components in applications where excellent thermal shock resistance, high electrical resistivity and chemical and corrosion resistance is required.

Physical vapor deposition refers to the extensive range of vacuum-based thin-film coating methods employed for surface engineering of a variety of materials. Employing one of the several methods to generate and deposit target material onto a substrate surface, including sputter deposition, PVD Coating methods are commonly used in the construction of optoelectronic devices, precision components for automotive and aerospace, and more.

Sputtering is a unique process where particles are forcefully ejected from a target material by sustained plasma bombardment. Boron nitride ceramics are broadly used to constrain plasma arcs in sputtering chambers onto the target material and prevent erosion of integral components in the process chamber.

BN ceramic components such as insulating shrouds and rails, target frames, protective tubes, shields and liners as well as insulators ensure that the PVD arc remains constrained towards the target, preventing equipment damage.

Innovacera 99% BN is commonly used as an alternative for pyrolytic Boron Nitride in these applications.

Properties
Boron Nitride Properties
 BN99BN-CABN-ABN-BBN-CBN-DBN-E
Main CompositionBN>99%BN>97.5%BN+SIBN+ALBN+SICBN+ZRO2BN+ALN
Bonding CompositionB2O3Boron calcium oxideBoron oxide siliconBoron oxide aluminumBoron oxide aluminumB2O3Boron oxide aluminum
Density(g/cm3)1.95-2.02.0-2.12.25-2.352.25-2.352.35-2.502.9-3.02.5-2.6
Room Temperature Electric Resistivity (Ω·cm)>1014>1013>1012>1012>1012>1012>1013
Max Using Temperature(℃)
In Atmosphere
In Inactive Gas
In High Vacuum(Long Time)
900
2100
1900
900
2100
1900
1000
1700
1700
1000
1700
1700
1000
1700
1700
1000
1800
1800
1000
1800
1800
Three-Point Bending Strength (MPA)30358285105120110
Compressive Strength (MPA)5870148150175200185
Thermal Expansion Coefficient(20-1000℃)
(10-6/K)
1.51.61.81.94.06.03.0
Thermal Conductivity (W/m·k)30323535403055
Typical Application:High Temperature FuranceHigh Temperature FurancePowder MetallurgyPowder MetallurgyPowder MetallurgyMetal CastingHigh Temperature
Equipment
High Temperature Electrical Furnace Components(High Temperature Insulator Sleeve Tube etc)YY    Y
Metal Vaporize CrucibleYY     
The Container Of Metal or Glass MeltingYYYYYYY
The Casting Mould Components Of The Precious Metal And Special Alloy.YYYYYYY
High Temperature Support Part  YYYYY
Nozzle And Transport Tube Of The Melting MetalYYYYY  
Remark: The value is just for review, different using conditions will have a little difference.

 

Application

 

·         Electric insulators in PVD and CVD Vacuum Coating chambers

·         Break Rings for Horizontal Steel Casting

·         Evaporator Boats for Aluminum Metallization

·         Components for semiconductor manufacturing equipment

·         Neutron absorbers

·         Boron dopant for Silicon wafer

·         Electronic component assembling jigs

·         Spacers for glass melts and nonferrous

·         Feedthroughs for high voltage equipment

·         Nozzles for nonferroud metals

·         Crucibles for crystal growth

·         Diffusion source wafers

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